Non-traditional machining techniques for silicon wafers

Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining are widely used cut or pattern Si, order obtain high-quality surface finishes fabrication of three-dimensional (3D) microstructures In this work, capabilities competencies non-traditional Si techniques, including ultrasonic, ion beam milling, laser machining, electrical discharge discussed compared accordingly. The working principles, advantages, limitations, that been fabricated before detail. Additionally, work covers performance reported by multiple researchers on these methods, spanning temporal range 1990 2020. key outcomes study explored summarized.